Købe SSTVA16859AGT med BYCHPS
Køb med garanti
SSTVA16859AGT
- Varenummer:
- SSTVA16859AGT
- Fabrikant:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC BUFFER DDR 13-26BIT 64-TSSOP
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 13781 Pieces
- Datablad:
- SSTVA16859AGT.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SSTVA16859AGT, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SSTVA16859AGT via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Forsyningsspænding: | 2.3 V ~ 2.7 V |
|---|---|
| Leverandør Device Package: | 64-TSSOP |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 64-TFSOP (0.240", 6.10mm Width) |
| Driftstemperatur: | 0°C ~ 70°C |
| Antal bitter: | 13, 26 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | SSTVA16859AGT |
| Logik Type: | Registered Buffer with SSTL_2 Compatible I/O for DDR |
| Udvidet beskrivelse: | Registered Buffer with SSTL_2 Compatible I/O for DDR IC 64-TSSOP |
| Beskrivelse: | IC BUFFER DDR 13-26BIT 64-TSSOP |
| Email: | [email protected] |
Relaterede dele til SSTVA16859AGT
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers