Købe SSTVF16857DGG,512 med BYCHPS
Køb med garanti
SSTVF16857DGG,512
- Varenummer:
- SSTVF16857DGG,512
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC REG DRIVER 14BIT SSTL 48TSSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17767 Pieces
- Datablad:
- SSTVF16857DGG,512.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SSTVF16857DGG,512, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SSTVF16857DGG,512 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Forsyningsspænding: | 2.3 V ~ 2.7 V |
|---|---|
| Leverandør Device Package: | 48-TSSOP |
| Serie: | 74SSTVF |
| Emballage: | Tube |
| Pakke / tilfælde: | 48-TFSOP (0.240", 6.10mm Width) |
| Andre navne: | 935274462512 SSTVF16857DGG SSTVF16857DGG-ND |
| Driftstemperatur: | 0°C ~ 70°C |
| Antal bitter: | 14 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | SSTVF16857DGG,512 |
| Logik Type: | Registered Buffer with SSTL_2 Compatible I/O for DDR |
| Udvidet beskrivelse: | Registered Buffer with SSTL_2 Compatible I/O for DDR IC 48-TSSOP |
| Beskrivelse: | IC REG DRIVER 14BIT SSTL 48TSSOP |
| Email: | [email protected] |
Relaterede dele til SSTVF16857DGG,512
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SSTVF16859BS,118 | NXP USA Inc. | IC REG BUFF 13BIT SSTL 56HVQFN | Forespørgsel |
|
SSTVF16859BS,157 | NXP USA Inc. | IC BUFFER DDR 13BIT 56-HVQFN | Forespørgsel |
 |
SSTVF16857EV,518 | NXP USA Inc. | IC REGISTERED DVR 14BIT 56BGA | Forespørgsel |
 |
SSTVF16857DGV,112 | NXP USA Inc. | IC REG DRIVER 14BIT SSTL 48STTOP | Forespørgsel |
|
SSTVF16859BS,151 | NXP USA Inc. | IC BUFFER DDR 13BIT 56-HVQFN | Forespørgsel |
 |
SSTVF16857DGV,118 | NXP USA Inc. | IC REG DRIVER 14BIT SSTL 48TSSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers