Købe STCCP27ATBR med BYCHPS
Køb med garanti
STCCP27ATBR
- Varenummer:
- STCCP27ATBR
- Fabrikant:
- ST
- Beskrivelse:
- IC LINE RCVR DUAL DIFF 25-TFBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16870 Pieces
- Datablad:
- STCCP27ATBR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for STCCP27ATBR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til STCCP27ATBR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 2.65 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 25-uTFBGA (3x3) |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 25-TFBGA |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | STCCP27ATBR |
| grænseflade: | - |
| Udvidet beskrivelse: | Receiver Interface 25-uTFBGA (3x3) |
| Beskrivelse: | IC LINE RCVR DUAL DIFF 25-TFBGA |
| Applikationer: | Receiver |
| Email: | [email protected] |
Relaterede dele til STCCP27ATBR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MC34978AEKR2 | NXP USA Inc. | IC INTERFACE SW DETECT 32-SOIC | Forespørgsel |
 |
DS90CR286AQMT/NOPB | Texas Instruments | IC RCVR 28BIT CHAN LINK 56-TSSOP | Forespørgsel |
 |
MC10EP446FA | ON Semiconductor | IC CONV 8BIT SER/PAR ECL 32LQFP | Forespørgsel |
 |
82V2604BB | IDT, Integrated Device Technology Inc | IC INVERSE MUX 4CH ATM 208-BGA | Forespørgsel |
 |
Z84C4408VEC | Zilog | IC 8MHZ Z80 CMOS SIO/4 44-PLCC | Forespørgsel |
 |
89HPES16T4G2ZABX | IDT, Integrated Device Technology Inc | IC PCI SW 16LANE 4PORT 288-SBGA | Forespørgsel |
|
MC100EP446FAG | ON Semiconductor | IC CONV 8BIT SER/PAR ECL 32LQFP | Forespørgsel |
|
89HPES16H16ZABL | IDT, Integrated Device Technology Inc | IC PCI SW 16LANE 16PORT 484FCBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers