Købe STH250N55F3-6 med BYCHPS
Køb med garanti
STH250N55F3-6
- Varenummer:
- STH250N55F3-6
- Fabrikant:
- ST
- Beskrivelse:
- MOSFET N-CH 55V 180A H2PAK-6
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16901 Pieces
- Datablad:
- STH250N55F3-6.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for STH250N55F3-6, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til STH250N55F3-6 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 4V @ 250µA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | H²PAK |
| Serie: | STripFET™ III |
| Rds On (Max) @ Id, Vgs: | 2.6 mOhm @ 60A, 10V |
| Power Dissipation (Max): | 300W (Tc) |
| Emballage: | Cut Tape (CT) |
| Pakke / tilfælde: | TO-263-7, D²Pak (6 Leads + Tab) |
| Andre navne: | 497-11309-1 |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | STH250N55F3-6 |
| Inputkapacitans (Ciss) (Max) @ Vds: | 6800pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 100nC @ 10V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 55V 180A (Tc) 300W (Tc) Surface Mount H²PAK |
| Afløb til Source Voltage (VDSS): | 55V |
| Beskrivelse: | MOSFET N-CH 55V 180A H2PAK-6 |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 180A (Tc) |
| Email: | [email protected] |
Relaterede dele til STH250N55F3-6
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog