Købe STK541UC62K-E med BYCHPS
Køb med garanti
STK541UC62K-E
- Varenummer:
- STK541UC62K-E
- Fabrikant:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- MOD IPM INVERTER 3PH SIP23
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14729 Pieces
- Datablad:
- STK541UC62K-E.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for STK541UC62K-E, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til STK541UC62K-E via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Isolering: | 2000Vrms |
|---|---|
| Spænding: | 600V |
| Type: | IGBT |
| Serie: | - |
| Pakke / tilfælde: | 23-PowerSIP Module, 19 Leads, Formed Leads |
| Andre navne: | STK541UC62K-EOS |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 24 Weeks |
| Producentens varenummer: | STK541UC62K-E |
| Udvidet beskrivelse: | Power Driver Module IGBT 3 Phase 600V 10A 23-PowerSIP Module, 19 Leads, Formed Leads |
| Beskrivelse: | MOD IPM INVERTER 3PH SIP23 |
| Nuværende: | 10A |
| Konfiguration: | 3 Phase |
| Email: | [email protected] |
Relaterede dele til STK541UC62K-E
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
STK544UC61K-E | ON Semiconductor | IC MOTOR DRIVER | Forespørgsel |
 |
IRAMS10UP60B | Infineon Technologies | PLUG N DRIVE INTELLIGENT PWR MOD | Forespørgsel |
 |
PM150CSD060 | Powerex Inc. | MOD IPM 6PAC 600V 150A | Forespørgsel |
 |
STK541UC60C-E | ON Semiconductor | MODULE IPM INVERTER 3PH 23SIP | Forespørgsel |
 |
PS21962-4 | Powerex Inc. | MOD IPM 600V 5A SUPERMINI DIP | Forespørgsel |
 |
FNA51560T3 | Fairchild/ON Semiconductor | MODULE SPM 600V 15A SPM55 | Forespørgsel |
 |
FSBM10SH60A | Fairchild/ON Semiconductor | SMART POWER MODULE 10A SPM32-AA | Forespørgsel |
 |
STK544UC62K-E | ON Semiconductor | IC BRIDGE DRIVER PAR 23SIP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers