Købe SY84113BUMG med BYCHPS
Køb med garanti
SY84113BUMG
- Varenummer:
- SY84113BUMG
- Fabrikant:
- Micrel / Microchip Technology
- Beskrivelse:
- IC AMP LIMIT 1.25GBPS 2.5V 16QFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19957 Pieces
- Datablad:
- SY84113BUMG.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SY84113BUMG, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SY84113BUMG via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Postamplifier |
|---|---|
| Leverandør Device Package: | 16-QFN (3x3) |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 16-VFQFN Exposed Pad |
| Andre navne: | 576-3852 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 2 (1 Year) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | SY84113BUMG |
| Udvidet beskrivelse: | Postamplifier IC Optical Networks 16-QFN (3x3) |
| Beskrivelse: | IC AMP LIMIT 1.25GBPS 2.5V 16QFN |
| Applikationer: | Optical Networks |
| Email: | [email protected] |
Relaterede dele til SY84113BUMG
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SY84113BUMG-TR | Microchip Technology | IC LIMITING POST AMP 16-QFN | Forespørgsel |
 |
MAX3268CUB | Maxim Integrated | IC AMP LIMITING 1.25GBPS 10UMAX | Forespørgsel |
 |
NT23L50-GRP6 | Semtech Corporation | IC AMP TIA AGC OC-3/FE BARE DIE | Forespørgsel |
 |
LM392DGKT | Texas Instruments | IC OPAMP/VOLT COMP LP 8VSSOP | Forespørgsel |
 |
MAX3657ETC+T | Maxim Integrated | IC AMP TRANSIMPEDANCE 12TQFN | Forespørgsel |
 |
LTC6400CUD-8#TRPBF | Linear Technology | IC ADC DRIVER DIFF 2.2GHZ 16QFN | Forespørgsel |
 |
SY88903VKC-TR | Microchip Technology | IC AMP POST PECL 3.3V TTL 10MSOP | Forespørgsel |
 |
LTC6360IMS8E#TRPBF | Linear Technology | IC ADC DRIVER TRUE ZERO 8MSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog