Købe T322D336K010AT med BYCHPS
Køb med garanti
T322D336K010AT
- Varenummer:
- T322D336K010AT
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP TANT 33UF 10V 10% AXIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17750 Pieces
- Datablad:
- T322D336K010AT.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for T322D336K010AT, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til T322D336K010AT via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 10V |
|---|---|
| Type: | Molded |
| Tolerance: | ±10% |
| Størrelse / Dimension: | 0.180" Dia x 0.420" L (4.57mm x 10.67mm) |
| Serie: | T322 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Axial |
| Andre navne: | 399-4548 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens størrelse Kode: | D |
| Producentens varenummer: | T322D336K010AT |
| Levetid @ Temp.: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | General Purpose |
| Fejlrate: | - |
| Udvidet beskrivelse: | 33µF ±10% Molded Tantalum Capacitors 10V Axial 2.1 Ohm |
| ESR (Equivalent Series Resistance): | 2.1 Ohm |
| Beskrivelse: | CAP TANT 33UF 10V 10% AXIAL |
| kapacitans: | 33µF |
| Email: | [email protected] |
Relaterede dele til T322D336K010AT
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
T322D336K010AS | KEMET | CAP TANT 33UF 10V 10% AXIAL | Forespørgsel |
|
T322D336K015AS | KEMET | CAP TANT 33UF 15V 10% AXIAL | Forespørgsel |
|
T322D396K010AT | KEMET | CAP TANT 39UF 10V 10% AXIAL | Forespørgsel |
|
T322D335K050AT | KEMET | CAP TANT 3.3UF 50V 10% AXIAL | Forespørgsel |
|
T322D336K015AT | KEMET | CAP TANT 33UF 15V 10% AXIAL | Forespørgsel |
|
T322D335K050AS | KEMET | CAP TANT 3.3UF 50V 10% AXIAL | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog