Købe T521X107M025AHE030 med BYCHPS
Køb med garanti
T521X107M025AHE030
- Varenummer:
- T521X107M025AHE030
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP TANT POLY 100UF 25V 7343
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 15242 Pieces
- Datablad:
- T521X107M025AHE030.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for T521X107M025AHE030, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til T521X107M025AHE030 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 25V |
|---|---|
| Type: | Molded |
| Tolerance: | ±20% |
| Størrelse / Dimension: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| Serie: | KO-CAP® T521 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 2917 (7343 Metric) |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens størrelse Kode: | X |
| Producentens varenummer: | T521X107M025AHE030 |
| Levetid @ Temp.: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | 0.169" (4.30mm) |
| Funktioner: | High Reliability |
| Udvidet beskrivelse: | 100µF ±20% Molded Tantalum Polymer Capacitor 25V 2917 (7343 Metric) 30 mOhm |
| ESR (Equivalent Series Resistance): | 30 mOhm |
| Beskrivelse: | CAP TANT POLY 100UF 25V 7343 |
| kapacitans: | 100µF |
| Email: | [email protected] |
Relaterede dele til T521X107M025AHE030
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
T521X107M025ATE060 | KEMET | CAP TANTALUM 100UF 25V 2917 | Forespørgsel |
|
T521X107M025ATE0307280 | KEMET | CAP TANT POLY 100UF 25V 7343 | Forespørgsel |
|
T521X106M075ATE050 | KEMET | CAP TANT POLY 10UF 75V 7343 | Forespørgsel |
|
T521X107M025AHE0307280 | KEMET | CAP TANT POLY 100UF 25V 7343 | Forespørgsel |
|
T521X107M025ATE030 | KEMET | CAP TANT POLY 100UF 25V 7343 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers