Købe T550B827M006AT4251 med BYCHPS
Køb med garanti
T550B827M006AT4251
- Varenummer:
- T550B827M006AT4251
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP TANT POLY 820UF 6V AXIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15304 Pieces
- Datablad:
- T550B827M006AT4251.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for T550B827M006AT4251, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til T550B827M006AT4251 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 6V |
|---|---|
| Type: | Hermetically Sealed |
| Tolerance: | ±20% |
| Størrelse / Dimension: | 0.281" Dia x 0.641" L (7.14mm x 16.28mm) |
| Serie: | T550 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Axial |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens størrelse Kode: | B |
| Producentens varenummer: | T550B827M006AT4251 |
| Levetid @ Temp.: | 2000 Hrs @ 85°C |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | General Purpose |
| Udvidet beskrivelse: | 820µF ±20% Hermetically Sealed Tantalum Polymer Capacitor 6V Axial |
| ESR (Equivalent Series Resistance): | - |
| Beskrivelse: | CAP TANT POLY 820UF 6V AXIAL |
| kapacitans: | 820µF |
| Email: | [email protected] |
Relaterede dele til T550B827M006AT4251
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
T550B827M006AH | KEMET | CAP TANT POLY 820UF 6V AXIAL | Forespørgsel |
|
T550B827M006AT4250 | KEMET | CAP TANT POLY 820UF 6V AXIAL | Forespørgsel |
|
T550B827M006AH4251 | KEMET | CAP TANT POLY 820UF 6V AXIAL | Forespørgsel |
|
T550B827M006AH4250 | KEMET | CAP TANT POLY 820UF 6V AXIAL | Forespørgsel |
|
T550B827M006AT | KEMET | CAP TANT POLY 820UF 6V AXIAL | Forespørgsel |
|
T550B827K006AH | KEMET | CAP TANT POLY 820UF 6V AXIAL | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog