Købe T77S1D3-12 med BYCHPS
Køb med garanti
T77S1D3-12
- Varenummer:
- T77S1D3-12
- Beskrivelse:
- RELAY GEN PURPOSE SPST 3A 12V
- Blyfri Status / RoHS Status:
- Indeholder lead / RoHS-kompatibel
- Tilgængelig mængde:
- 15651 Pieces
- Datablad:
- 1.T77S1D3-12.pdf2.T77S1D3-12.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for T77S1D3-12, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til T77S1D3-12 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 9 VDC |
|---|---|
| Sluk spænding (Min): | 0.6 VDC |
| Afslutningsstil: | PC Pin |
| Skiftespænding: | 250VAC, 30VDC - Max |
| Serie: | T77 |
| Udgivelsestid: | 4ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | 1-1393194-5 PB371 T77S1D312 |
| Driftstemperatur: | -30°C ~ 105°C |
| Brug tid: | 10ms |
| Monteringstype: | Through Hole |
| Fabrikantens standard ledetid: | 18 Weeks |
| Producentens varenummer: | T77S1D3-12 |
| Funktioner: | Insulation - Class F, Sealed - Fully |
| Udvidet beskrivelse: | General Purpose Relay SPST-NO (1 Form A) 12VDC Coil Through Hole |
| Beskrivelse: | RELAY GEN PURPOSE SPST 3A 12V |
| Kontakt Rating (Aktuel): | 3A |
| Kontaktmateriale: | Silver (Ag) |
| Kontaktformular: | SPST-NO (1 Form A) |
| Spole spænding: | 12VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 720 Ohms |
| Coil Power: | 200 mW |
| Coil Current: | 16.7mA |
| Email: | [email protected] |
Relaterede dele til T77S1D3-12
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog