Købe TC1130L100EBGBBFXUMA1 med BYCHPS
Køb med garanti
TC1130L100EBGBBFXUMA1
- Varenummer:
- TC1130L100EBGBBFXUMA1
- Beskrivelse:
- IC MCU 32BIT ROMLESS 208LBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14816 Pieces
- Datablad:
- TC1130L100EBGBBFXUMA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TC1130L100EBGBBFXUMA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TC1130L100EBGBBFXUMA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 1.43 V ~ 1.58 V |
|---|---|
| Leverandør Device Package: | P-LBGA-208-2 |
| Fart: | 100MHz |
| Serie: | TC11xx |
| RAM-størrelse: | 144K x 8 |
| Programhukommelsestype: | ROMless |
| Programhukommelsesstørrelse: | - |
| tilbehør: | DMA, POR, PWM, WDT |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 208-LBGA |
| Andre navne: | FT1130L100EBGBBXP SAF-TC1130-L100EB-G BB SAF-TC1130-L100EB-GBB SAF-TC1130-L100EB-GBBINTR SAF-TC1130-L100EB-GBBINTR-ND SAF-TC1130-L100EB-GBBTR SAF-TC1130-L100EB-GBBTR-ND SAFTC1130L100EBBBXT SP000106539 SP000106540 SP000743586 |
| Oscillator Type: | External |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal I / O: | 72 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | TC1130L100EBGBBFXUMA1 |
| Udvidet beskrivelse: | TriCore™ TC11xx Microcontroller IC 32-Bit 100MHz ROMless P-LBGA-208-2 |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 32BIT ROMLESS 208LBGA |
| Datakonvertere: | - |
| Core Size: | 32-Bit |
| Core Processor: | TriCore™ |
| Connectivity: | CAN, EBI/EMI, FIFO, I²C, IrDA, SPI, UART/USART, USB |
| Email: | [email protected] |
Relaterede dele til TC1130L100EBGBBFXUMA1
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers