Købe TC1767256F133HRADKXUMA1 med BYCHPS
Køb med garanti
TC1767256F133HRADKXUMA1
- Varenummer:
- TC1767256F133HRADKXUMA1
- Beskrivelse:
- 32 BIT FLASH
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16152 Pieces
- Datablad:
- TC1767256F133HRADKXUMA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TC1767256F133HRADKXUMA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TC1767256F133HRADKXUMA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 1.42 V ~ 1.58 V |
|---|---|
| Leverandør Device Package: | 176-LQFP (24x24) |
| Fart: | 133MHz |
| Serie: | TC17xx |
| RAM-størrelse: | 128K x 8 |
| Programhukommelsestype: | FLASH |
| Programhukommelsesstørrelse: | 2MB (2M x 8) |
| tilbehør: | DMA, POR, WDT |
| Emballage: | Tray |
| Pakke / tilfælde: | 176-LQFP |
| Andre navne: | SP001007278 |
| Oscillator Type: | External |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| Antal I / O: | 88 |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 26 Weeks |
| Producentens varenummer: | TC1767256F133HRADKXUMA1 |
| Udvidet beskrivelse: | TriCore™ TC17xx Microcontroller IC 32-Bit 133MHz 2MB (2M x 8) FLASH 176-LQFP (24x24) |
| EEPROM-størrelse: | - |
| Beskrivelse: | 32 BIT FLASH |
| Datakonvertere: | A/D 4x10b, 32x12b |
| Core Size: | 32-Bit |
| Core Processor: | TriCore™ |
| Connectivity: | ASC, CAN, MLI, MSC, SSC |
| Email: | [email protected] |
Relaterede dele til TC1767256F133HRADKXUMA1
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
TC1767256F133HRADKFQMA1 | Infineon Technologies | 32 BIT FLASH | Forespørgsel |
|
TC1767256F80HLADKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 176LQFP | Forespørgsel |
|
TC1767256F133HLADKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 176LQFP | Forespørgsel |
|
TC1766192F80HLBDKXUMA2 | Infineon Technologies | 32 BIT FLASH | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers