Købe TC74ACT373P med BYCHPS
Køb med garanti
TC74ACT373P
- Varenummer:
- TC74ACT373P
- Fabrikant:
- Toshiba Semiconductor
- Beskrivelse:
- IC LATCH OCT D-TYPE 3-ST 20-DIP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13982 Pieces
- Datablad:
- TC74ACT373P.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TC74ACT373P, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TC74ACT373P via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 4.5 V ~ 5.5 V |
|---|---|
| Leverandør Device Package: | 20-DIP |
| Serie: | TC74ACT |
| Emballage: | Tube |
| Pakke / tilfælde: | 20-DIP (0.300", 7.62mm) |
| Output Type: | Tri-State |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | TC74ACT373P |
| Logik Type: | D-Type Transparent Latch |
| Uafhængige kredsløb: | 1 |
| Udvidet beskrivelse: | D-Type Transparent Latch Channel 8:8 IC Tri-State 20-DIP |
| Beskrivelse: | IC LATCH OCT D-TYPE 3-ST 20-DIP |
| Forsinkelsestid - Forplantning: | 5.9ns |
| Nuværende - Output High, Low: | 75mA, 75mA |
| Kredsløb: | 8:8 |
| Email: | [email protected] |
Relaterede dele til TC74ACT373P
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers