Købe TC74VHC540FTELM med BYCHPS
Køb med garanti
TC74VHC540FTELM
- Varenummer:
- TC74VHC540FTELM
- Fabrikant:
- Toshiba Semiconductor
- Beskrivelse:
- IC INVERTER 8-INPUT 20TSSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13634 Pieces
- Datablad:
- TC74VHC540FTELM.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TC74VHC540FTELM, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TC74VHC540FTELM via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 2 V ~ 5.5 V |
|---|---|
| Leverandør Device Package: | 20-TSSOP |
| Serie: | TC74VHC |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 20-TSSOP (0.173", 4.40mm Width) |
| Output Type: | Push-Pull |
| Andre navne: | 74VHC540FT(EL,M) 74VHC540FT(ELM)TR 74VHC540FT(ELM)TR-ND TC74VHC540FT (EL,M) TC74VHC540FT(EL) TC74VHC540FT(EL,M) TC74VHC540FT(ELM)TR TC74VHC540FT(ELM)TR-ND TC74VHC540FT-EL TC74VHC540FTELMTR TC74VHC540FTMTR TC74VHC540FTMTR-ND TC74VHC540FTTR TC74VHC540FTTR-ND |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal elementer: | 1 |
| Antal bit pr. Element: | 8 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | TC74VHC540FTELM |
| Logik Type: | Buffer, Inverting |
| Input Type: | - |
| Udvidet beskrivelse: | Buffer, Inverting Element 8 Bit per Element Push-Pull Output 20-TSSOP |
| Beskrivelse: | IC INVERTER 8-INPUT 20TSSOP |
| Nuværende - Output High, Low: | 8mA, 8mA |
| Email: | [email protected] |
Relaterede dele til TC74VHC540FTELM
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers