Købe TC75S59FU(TE85L,F) med BYCHPS
Køb med garanti
TC75S59FU(TE85L,F)
- Varenummer:
- TC75S59FU(TE85L,F)
- Fabrikant:
- Toshiba Semiconductor
- Beskrivelse:
- IC C0MP GP CMOS PUSH-PULL USV
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15027 Pieces
- Datablad:
- TC75S59FU(TE85L,F).pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TC75S59FU(TE85L,F), vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TC75S59FU(TE85L,F) via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Tilførsel, Single / Dual (±): | 1.8 V ~ 7 V, ±0.9 V ~ 3.5 V |
|---|---|
| Spænding - Indgangsforskydning (Max): | 7mV @ 5V |
| Type: | General Purpose |
| Leverandør Device Package: | USV |
| Serie: | - |
| Forplantningsforsinkelse (Max): | 200ns |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 5-TSSOP, SC-70-5, SOT-353 |
| Output Type: | Open Drain |
| Andre navne: | TC75S59FU(TE85LF)TR |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal elementer: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | TC75S59FU(TE85L,F) |
| Hysterese: | - |
| Udvidet beskrivelse: | Comparator General Purpose Open Drain USV |
| Beskrivelse: | IC C0MP GP CMOS PUSH-PULL USV |
| Nuværende - Quiescent (Max): | 220µA |
| Nuværende - Output (Typ): | 25mA |
| Nuværende - Input Bias (Max): | 1pA |
| CMRR, PSRR (Typ): | - |
| Email: | [email protected] |
Relaterede dele til TC75S59FU(TE85L,F)
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog