Købe TE0841-01-035-1C med BYCHPS
Køb med garanti
TE0841-01-035-1C
- Varenummer:
- TE0841-01-035-1C
- Fabrikant:
- Trenz Electronic
- Beskrivelse:
- SOM USCALE XCKU035-1C 1GB DDR4
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17341 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for TE0841-01-035-1C, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TE0841-01-035-1C via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Størrelse / Dimension: | 1.97" x 1.57" (50mm x 40mm) |
|---|---|
| Serie: | TE084x |
| RAM-størrelse: | 4GB |
| Andre navne: | 1686-1054 TE0841-01-035-1C-ND |
| Driftstemperatur: | 0°C ~ 70°C |
| Modul / Board Type: | FPGA |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | TE0841-01-035-1C |
| Flash størrelse: | 32MB |
| Udvidet beskrivelse: | TE084x Embedded Module Kintex UltraScale KU35 4GB 32MB |
| Beskrivelse: | SOM USCALE XCKU035-1C 1GB DDR4 |
| Core Processor: | Kintex UltraScale KU35 |
| Tilslutningstype: | Samtec LSHM |
| Co-processor: | - |
| Email: | [email protected] |
Relaterede dele til TE0841-01-035-1C
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
TE0841-01-035-2I | Trenz Electronic GmbH | SOM USCALE XCKU035-2I 1GB DDR4 | Forespørgsel |
|
TE0841-01-040-1I | Trenz Electronic GmbH | SOM USCALE XCKU040-1I 1GB DDR4 | Forespørgsel |
|
TE0841-01-040-1C | Trenz Electronic GmbH | SOM USCALE XCKU040-1C 1GB DDR4 | Forespørgsel |
 |
FS-353 | Digi International | MODULE 7U 16MB SDRAM 8MB FLASH | Forespørgsel |
|
TE0841-01-035-1I | Trenz Electronic GmbH | SOM USCALE XCKU035-1I 1GB DDR4 | Forespørgsel |
 |
DC-ME-Y402-C | Digi International | ME 9210 8MB SDRAM 4MB FLASH SGL | Forespørgsel |
 |
101-0446 | Digi International | MODULE RABBITCORE RCM2130 | Forespørgsel |
 |
EZ80F915050MODG | Zilog | MODULE EZ80F91 512K 50MHZ | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog