Købe TE600B330RJ med BYCHPS
Køb med garanti
TE600B330RJ
- Varenummer:
- TE600B330RJ
- Fabrikant:
- AMP Connectors / TE Connectivity
- Beskrivelse:
- RES CHAS MNT 330 OHM 5% 600W
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16526 Pieces
- Datablad:
- TE600B330RJ.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TE600B330RJ, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TE600B330RJ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±5% |
|---|---|
| Temperaturkoefficient: | ±440ppm/°C |
| Størrelse / Dimension: | 1.575" Dia x 13.583" L (40.00mm x 345.00mm) |
| Serie: | TE, CGS |
| Modstand (ohm): | 330 |
| Power (Watts): | 600W |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Tubular |
| Andre navne: | 3-1879451-1 3-1879451-1-ND |
| Driftstemperatur: | -25°C ~ 225°C |
| Monteringsfunktion: | Brackets |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | TE600B330RJ |
| Lead Style: | Solder Lugs |
| Højde - Siddende (Max): | - |
| Funktioner: | Flame Proof, Safety |
| Fejlrate: | - |
| Beskrivelse: | RES CHAS MNT 330 OHM 5% 600W |
| Sammensætning: | Wirewound |
| Belægning, Boligtype: | Silicon Coated |
| Email: | [email protected] |
Relaterede dele til TE600B330RJ
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers