Købe TISP7290F3SL med BYCHPS
Køb med garanti
TISP7290F3SL
- Varenummer:
- TISP7290F3SL
- Fabrikant:
- Bourns, Inc.
- Beskrivelse:
- SURGE SUPP 220V BIDIR 3-SL
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 14170 Pieces
- Datablad:
- TISP7290F3SL.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TISP7290F3SL, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TISP7290F3SL via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - på stat: | 5V |
|---|---|
| Spænding - Off State: | 220V |
| Spænding - Breakover: | 290V |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | Radial - 3 Leads |
| Antal elementer: | 3 |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | TISP7290F3SL |
| Beskrivelse: | SURGE SUPP 220V BIDIR 3-SL |
| Nuværende - Peak Pulse (8 / 20μs): | 175A |
| Nuværende - Peak Pulse (10 / 1000μs): | 45A |
| Nuværende - Hold (Ih): | 150mA |
| kapacitans: | 39pF |
| Email: | [email protected] |
Relaterede dele til TISP7290F3SL
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
TISP7290F3DR | Bourns Inc. | SURGE SUPP 220V BIDIR 8-SOIC | Forespørgsel |
|
TISP7290F3P | Bourns Inc. | SURGE SUPP 220V BIDIR 8-DIP | Forespørgsel |
|
TISP7260F3DR | Bourns Inc. | SURGE SUPP 200V BIDIR 8-SOIC | Forespørgsel |
|
TISP7290F3DR-S | Bourns Inc. | PROTECTOR TRIPLE BIDIRECTIONAL | Forespørgsel |
|
TISP7290H3SL | Bourns Inc. | SURGE SUPP 230V BIDIR 3-SL | Forespørgsel |
|
TISP7260F3P | Bourns Inc. | SURGE SUPP 200V BIDIR 8-DIP | Forespørgsel |
|
TISP7240F3DR | Bourns Inc. | SURGE SUPP 180V BIDIR 8-SOIC | Forespørgsel |
|
TISP7240F3P | Bourns Inc. | SURGE SUPP 180V BIDIR 8-DIP | Forespørgsel |
|
TISP7240F3SL | Bourns Inc. | SURGE SUPP 180V BIDIR 3-SL | Forespørgsel |
|
TISP7210H3SL | Bourns Inc. | SURGE SUPP 160V BIDIR 3-SL | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog