Købe TL026CDG4 med BYCHPS
Køb med garanti
TL026CDG4
- Varenummer:
- TL026CDG4
- Fabrikant:
- Beskrivelse:
- IC DIFF AMP W/AGC HI-FREQ 8-SOIC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13910 Pieces
- Datablad:
- TL026CDG4.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TL026CDG4, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TL026CDG4 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Tilførsel, Single / Dual (±): | ±3 V ~ 8 V |
|---|---|
| Leverandør Device Package: | 8-SOIC |
| Slew Rate: | - |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 8-SOIC (0.154", 3.90mm Width) |
| Output Type: | Differential |
| Antal kredsløb: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 2 (1 Year) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | TL026CDG4 |
| Beskrivelse: | IC DIFF AMP W/AGC HI-FREQ 8-SOIC |
| Nuværende - Forsyning: | 22mA |
| Nuværende - Output / Channel: | 4mA |
| Applikationer: | Automatic Gain Control (AGC) |
| -3db båndbredde: | 50MHz |
| Email: | [email protected] |
Relaterede dele til TL026CDG4
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EL5524IRE | Intersil | IC BUFFER 4XGAMMA 5.4MA 14HTSSOP | Forespørgsel |
|
SN10501DR | Texas Instruments | IC VIDEO AMP RR-OUT HS 8-SOIC | Forespørgsel |
|
TL026CD | Texas Instruments | IC DIFF AMP W/AGC HI-FREQ 8SOIC | Forespørgsel |
|
TL026CDR | Texas Instruments | IC DIFF AMP W/AGC HI-FREQ 8-SOIC | Forespørgsel |
|
TL026CPSR | Texas Instruments | IC DIFF AMP W/AGC HI-FREQ 8SO | Forespørgsel |
 |
EL8108IS-T13 | Intersil | IC AMP VIDEO DISTRIBUTION 8-SOIC | Forespørgsel |
|
TL026CP | Texas Instruments | IC AGC VIDEO AMP 8DIP | Forespørgsel |
|
TL026CPG4 | Texas Instruments | IC DIFF AMP W/AGC HI-FREQ 8-DIP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers