Købe TMK105BJ103MP-F med BYCHPS
Køb med garanti
TMK105BJ103MP-F
- Varenummer:
- TMK105BJ103MP-F
- Fabrikant:
- Taiyo Yuden
- Beskrivelse:
- CAP ,MLCC ,0402,25V ,X5R,10000PF
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15896 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for TMK105BJ103MP-F, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TMK105BJ103MP-F via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Andre navne: | 587-5477-2 RM TMK105 BJ103MP-F |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | TMK105BJ103MP-F |
| Udvidet beskrivelse: | Ceramic Capacitor |
| Beskrivelse: | CAP ,MLCC ,0402,25V ,X5R,10000PF |
| Email: | [email protected] |
Relaterede dele til TMK105BJ103MP-F
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
TMK105B7472MV-F | Taiyo Yuden | CAP CER 4700PF 25V X7R 0402 | Forespørgsel |
 |
TMK105BJ104MV-F | Taiyo Yuden | CAP CER 0.1UF 25V X5R SMD | Forespørgsel |
|
TMK105BJ104KV-F | Taiyo Yuden | CAP CER 0.1UF 25V X5R 0402 | Forespørgsel |
|
TMK105BJ103KVHF | Taiyo Yuden | CAP CER 10000PF 25V X5R 0402 | Forespørgsel |
|
TMK105BJ104KVHF | Taiyo Yuden | CAP CER 0.1UF 25V X5R 0402 | Forespørgsel |
|
TMK105BJ103KP-F | Taiyo Yuden | CAP CER 10000PF 25V X5R 0402 | Forespørgsel |
|
TMK105BJ105KV-F | Taiyo Yuden | CAP CER 1UF 25V X5R 0402 | Forespørgsel |
|
TMK105B7153KV-F | Taiyo Yuden | CAP CER 0.015UF 25V X7R 0402 | Forespørgsel |
|
TMK105BJ473KV-F | Taiyo Yuden | CAP CER 0.047UF 25V X5R 0402 | Forespørgsel |
|
TMK105BJ105MV-F | Taiyo Yuden | CAP CER 1UF 25V X5R 0402 | Forespørgsel |
|
TMK105SD102JV-F | Taiyo Yuden | CAP CER 1000PF 25V 0402 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers