Købe TR3W107K025C0200 med BYCHPS
Køb med garanti
TR3W107K025C0200
- Varenummer:
- TR3W107K025C0200
- Fabrikant:
- Vishay / Sprague
- Beskrivelse:
- CAP TANT 100UF 25V 10% 2924
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19124 Pieces
- Datablad:
- TR3W107K025C0200.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TR3W107K025C0200, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TR3W107K025C0200 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 25V |
|---|---|
| Type: | Molded |
| Tolerance: | ±10% |
| Størrelse / Dimension: | 0.287" L x 0.236" W (7.30mm x 6.00mm) |
| Serie: | TANTAMOUNT®, TR3 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 2924 (7360 Metric) |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens størrelse Kode: | W |
| Producentens varenummer: | TR3W107K025C0200 |
| Levetid @ Temp.: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | 0.150" (3.80mm) |
| Funktioner: | General Purpose |
| Fejlrate: | - |
| Udvidet beskrivelse: | 100µF ±10% Molded Tantalum Capacitors 25V 2924 (7360 Metric) 200 mOhm |
| ESR (Equivalent Series Resistance): | 200 mOhm |
| Beskrivelse: | CAP TANT 100UF 25V 10% 2924 |
| kapacitans: | 100µF |
| Email: | [email protected] |
Relaterede dele til TR3W107K025C0200
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
TR3W107K025C0100 | Vishay Sprague | CAP TANT 100UF 25V 10% 2924 | Forespørgsel |
|
TR3W107K020C0060 | Vishay Sprague | CAP TANT 100UF 20V 10% 2924 | Forespørgsel |
|
TR3W107K025C0150 | Vishay Sprague | CAP TANT 100UF 25V 10% 2924 | Forespørgsel |
|
TR3W107K020C0100 | Vishay Sprague | CAP TANT 100UF 20V 10% 2924 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers