Købe TW6872-NA1-CR med BYCHPS
Køb med garanti
TW6872-NA1-CR
- Varenummer:
- TW6872-NA1-CR
- Fabrikant:
- Intersil
- Beskrivelse:
- IC TXRX SDI VC-2 76QFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13129 Pieces
- Datablad:
- TW6872-NA1-CR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TW6872-NA1-CR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TW6872-NA1-CR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Transmitter |
|---|---|
| Leverandør Device Package: | 76-QFN (9x9) |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 76-VFQFN Exposed Pad |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | TW6872-NA1-CR |
| Beskrivelse: | IC TXRX SDI VC-2 76QFN |
| Applikationer: | HD Video |
| Email: | [email protected] |
Relaterede dele til TW6872-NA1-CR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SI2169-A20-GM | Silicon Labs | IC DEMOD DVB-T2/T/C/S/S2 48QFN | Forespørgsel |
 |
PTN3381BBS,518 | NXP USA Inc. | IC LEVEL SHIFTER HDMI/DVI 48VQFN | Forespørgsel |
 |
TW6874-BB1-CR | Intersil | IC RECEIVER SDI 4CH 256BGA | Forespørgsel |
 |
IP4790CZ38,118 | NXP USA Inc. | IC DISPLAYPORT ESD PROT 38TSSOP | Forespørgsel |
 |
GS1660-IBE3 | Semtech Corporation | IC SDI RECEIVER SMPTE 100BGA | Forespørgsel |
 |
LT1675CS8-1#PBF | Linear Technology | IC MUX RGB HI-SPEED SINGLE 8SOIC | Forespørgsel |
 |
MC44BC374EJB | NXP USA Inc. | IC MODULATOR ANT BOOSTER 24TSSOP | Forespørgsel |
 |
ISL24867IRXZ | Intersil | IC TFT-LCD REF VOLT GEN 28X2QFN | Forespørgsel |
 |
FMS6243MTC14X | Fairchild/ON Semiconductor | IC DRIVER SD VID FILTER 14-TSSOP | Forespørgsel |
 |
LMH0356SQ/NOPB | Texas Instruments | IC RECLOCKER HD/SD SDI 48WQFN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers