Købe TYEH1C107F55MTR med BYCHPS
Køb med garanti
TYEH1C107F55MTR
- Varenummer:
- TYEH1C107F55MTR
- Fabrikant:
- AMP Connectors / TE Connectivity
- Beskrivelse:
- CAP ALUM 100UF 20% 16V SMD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14227 Pieces
- Datablad:
- TYEH1C107F55MTR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TYEH1C107F55MTR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TYEH1C107F55MTR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 16V |
|---|---|
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | 0.260" L x 0.260" W (6.60mm x 6.60mm) |
| Størrelse / Dimension: | 0.248" Dia (6.30mm) |
| Serie: | TYEH, Neohm |
| Ripple Current: | 70mA |
| Polarisering: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Radial, Can - SMD |
| Andre navne: | 2-1879291-3 2-1879291-3-ND |
| Driftstemperatur: | -40°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | TYEH1C107F55MTR |
| Levetid @ Temp.: | 1000 Hrs @ 105°C |
| Blyafstand: | - |
| Impedans: | - |
| Højde - Siddende (Max): | 0.209" (5.30mm) |
| Udvidet beskrivelse: | 100µF 16V Aluminum Capacitors Radial, Can - SMD 1000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | - |
| Beskrivelse: | CAP ALUM 100UF 20% 16V SMD |
| kapacitans: | 100µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til TYEH1C107F55MTR
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers