Købe UMZ16NT106 med BYCHPS
Køb med garanti
UMZ16NT106
- Varenummer:
- UMZ16NT106
- Fabrikant:
- LAPIS Semiconductor
- Beskrivelse:
- DIODE ZENER ARRAY 16V 200MW UMD3
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13282 Pieces
- Datablad:
- UMZ16NT106.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for UMZ16NT106, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til UMZ16NT106 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Zener (Nom) (Vz): | 16V |
|---|---|
| Spænding - Videresend (Vf) (Max) @ Hvis: | - |
| Tolerance: | - |
| Leverandør Device Package: | UMD3 |
| Serie: | - |
| Strøm - Max: | 200mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | SC-70, SOT-323 |
| Andre navne: | UMZ16NT106-ND UMZ16NT106TR |
| Driftstemperatur: | - |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | UMZ16NT106 |
| Impedans (Max) (Zzt): | 50 Ohm |
| Udvidet beskrivelse: | Zener Diode Array 1 Pair Common Anode 200mW UMD3 |
| Beskrivelse: | DIODE ZENER ARRAY 16V 200MW UMD3 |
| Nuværende - Reverse Lækage @ Vr: | 100nA @ 12V |
| Konfiguration: | 1 Pair Common Anode |
| Email: | [email protected] |
Relaterede dele til UMZ16NT106
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MMBZ5257BS-7-F | Diodes Incorporated | DIODE ZENER ARRAY 33V SOT363 | Forespørgsel |
 |
AZ23B12-HE3-18 | Vishay Semiconductor Diodes Division | DIODE ZENER 12V 300MW SOT23 | Forespørgsel |
|
AZ23B10-E3-08 | Vishay Semiconductor Diodes Division | DIODE ZENER 10V 300MW SOT23 | Forespørgsel |
 |
UMZ18NT106 | Rohm Semiconductor | DIODE ZENER ARRAY 18V 200MW UMD3 | Forespørgsel |
 |
DZ23C3V9-7-F | Diodes Incorporated | DIODE ZENER ARRAY 3.9V SOT23-3 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers