Købe UPD70F3523GJA-GAE-G med BYCHPS
Køb med garanti
UPD70F3523GJA-GAE-G
- Varenummer:
- UPD70F3523GJA-GAE-G
- Fabrikant:
- Renesas Electronics America
- Beskrivelse:
- IC MCU 32BIT 512KB FLASH 144LQFP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15930 Pieces
- Datablad:
- UPD70F3523GJA-GAE-G.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for UPD70F3523GJA-GAE-G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til UPD70F3523GJA-GAE-G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 2.7 V ~ 5.5 V |
|---|---|
| Leverandør Device Package: | 144-LQFP (20x20) |
| Fart: | 80MHz |
| Serie: | V850E2/Dx4 |
| RAM-størrelse: | 48K x 8 |
| Programhukommelsestype: | FLASH |
| Programhukommelsesstørrelse: | 512KB (512K x 8) |
| tilbehør: | DMA, LCD, LVD, POR, PWM, WDT |
| Emballage: | Tray |
| Pakke / tilfælde: | 144-LQFP |
| Oscillator Type: | Internal |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal I / O: | 105 |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 24 Weeks |
| Producentens varenummer: | UPD70F3523GJA-GAE-G |
| Udvidet beskrivelse: | V850E2M V850E2/Dx4 Microcontroller IC 32-Bit 80MHz 512KB (512K x 8) FLASH 144-LQFP (20x20) |
| EEPROM-størrelse: | 32K x 8 |
| Beskrivelse: | IC MCU 32BIT 512KB FLASH 144LQFP |
| Datakonvertere: | A/D 16x10b, A/D 16x12b |
| Core Size: | 32-Bit |
| Core Processor: | V850E2M |
| Connectivity: | CAN, CSI, I²C, LIN, UART/USART |
| Email: | [email protected] |
Relaterede dele til UPD70F3523GJA-GAE-G
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers