Købe UPD70F3825GB-GAH-AX med BYCHPS
Køb med garanti
UPD70F3825GB-GAH-AX
- Varenummer:
- UPD70F3825GB-GAH-AX
- Fabrikant:
- Renesas Electronics America
- Beskrivelse:
- IC MCU 32BIT 256KB FLASH 64LFQFP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14849 Pieces
- Datablad:
- UPD70F3825GB-GAH-AX.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for UPD70F3825GB-GAH-AX, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til UPD70F3825GB-GAH-AX via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 2.85 V ~ 3.6 V |
|---|---|
| Fart: | 48MHz |
| Serie: | V850ES/Jx3-H |
| RAM-størrelse: | 24K x 8 |
| Programhukommelsestype: | FLASH |
| Programhukommelsesstørrelse: | 256KB (256K x 8) |
| tilbehør: | DMA, LVD, PWM, WDT |
| Emballage: | Tray |
| Pakke / tilfælde: | 64-LQFP |
| Oscillator Type: | Internal |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal I / O: | 45 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 24 Weeks |
| Producentens varenummer: | UPD70F3825GB-GAH-AX |
| Udvidet beskrivelse: | V850ES V850ES/Jx3-H Microcontroller IC 32-Bit 48MHz 256KB (256K x 8) FLASH |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 32BIT 256KB FLASH 64LFQFP |
| Datakonvertere: | A/D 10x10b; D/A 1x8b |
| Core Size: | 32-Bit |
| Core Processor: | V850ES |
| Connectivity: | CAN, CSI, EBI/EMI, I²C, UART/USART, USB |
| Email: | [email protected] |
Relaterede dele til UPD70F3825GB-GAH-AX
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog