Købe USBULC6-2F3 med BYCHPS
Køb med garanti
USBULC6-2F3
- Varenummer:
- USBULC6-2F3
- Fabrikant:
- ST
- Beskrivelse:
- TVS DIODE 3VWM 4FLIPCHIP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15761 Pieces
- Datablad:
- USBULC6-2F3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for USBULC6-2F3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til USBULC6-2F3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Reverse Standoff (Typ): | 3V |
|---|---|
| Spænding - Klemme (Max) @ Ipp: | - |
| Spænding - Opdeling (Min): | 6V |
| Envejs kanaler: | 2 |
| Type: | Steering (Rail to Rail) |
| Leverandør Device Package: | 4-FlipChip |
| Serie: | USB, Transil™ |
| Power Line Protection: | Yes |
| Power - Peak Pulse: | 60W |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 4-WFBGA, FCBGA |
| Andre navne: | 497-8166-2 USBULC6-2F3-ND USBULC62F3 |
| Driftstemperatur: | -30°C ~ 85°C (TA) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | USBULC6-2F3 |
| Beskrivelse: | TVS DIODE 3VWM 4FLIPCHIP |
| Nuværende - Peak Pulse (10 / 1000μs): | - |
| Kapacitans @ Frekvens: | 1.2pF @ 1MHz |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til USBULC6-2F3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers