Købe VB60170G-E3/8W med BYCHPS
Køb med garanti
VB60170G-E3/8W
- Varenummer:
- VB60170G-E3/8W
- Fabrikant:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- DIODE ARRAY SCHOTTKY 170V TO263
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12231 Pieces
- Datablad:
- VB60170G-E3/8W.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for VB60170G-E3/8W, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til VB60170G-E3/8W via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 1.02V @ 30A |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 170V |
| Leverandør Device Package: | TO-263AB |
| Fart: | Fast Recovery = 200mA (Io) |
| Serie: | TMBS® |
| Emballage: | Original-Reel® |
| Pakke / tilfælde: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Andre navne: | VB60170G-E3/8WGIDKR |
| Driftstemperatur - Junction: | -40°C ~ 175°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 26 Weeks |
| Producentens varenummer: | VB60170G-E3/8W |
| Udvidet beskrivelse: | Diode Array 1 Pair Common Cathode Schottky 170V 30A Surface Mount TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Diodetype: | Schottky |
| Diode Konfiguration: | 1 Pair Common Cathode |
| Beskrivelse: | DIODE ARRAY SCHOTTKY 170V TO263 |
| Nuværende - Reverse Lækage @ Vr: | 450µA @ 170V |
| Nuværende - Gennemsnitlig Rectified (Io) (pr. Diode): | 30A |
| Email: | [email protected] |
Relaterede dele til VB60170G-E3/8W
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers