Købe VP3-0047-R med BYCHPS
Køb med garanti
VP3-0047-R
- Varenummer:
- VP3-0047-R
- Fabrikant:
- Bussmann (Eaton)
- Beskrivelse:
- INDUCT ARRAY 6 COIL 3.8UH SMD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18485 Pieces
- Datablad:
- VP3-0047-R.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for VP3-0047-R, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til VP3-0047-R via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | - |
|---|---|
| Størrelse / Dimension: | 0.673" L x 0.878" W (17.10mm x 22.30mm) |
| Afskærmning: | Unshielded |
| Serie: | VERSA-PAC® |
| Emballage: | Original-Reel® |
| Pakke / tilfælde: | 12-SMD |
| Andre navne: | 513-1695-6 |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal coils: | 6 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | VP3-0047-R |
| Højde: | 0.331" (8.40mm) |
| Udvidet beskrivelse: | Unshielded Coil Inductor Array 12-SMD |
| Beskrivelse: | INDUCT ARRAY 6 COIL 3.8UH SMD |
| DC-resistens (DCR) - Serie: | - |
| DC-modstand (DCR) - Parallel: | - |
| Email: | [email protected] |
Relaterede dele til VP3-0047-R
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
VP3-0055-R | Eaton | INDUCT ARRAY 6 COIL 4.5UH SMD | Forespørgsel |
 |
SRF1280A-470M | Bourns Inc. | INDUCT ARRAY 2 COIL 47UH SMD | Forespørgsel |
|
VP3-0084-R | Eaton | INDUCT ARRAY 6 COIL 6.8UH SMD | Forespørgsel |
 |
CTX150-4-R | Eaton | INDUCT ARRAY 2 COIL 148.23UH SMD | Forespørgsel |
 |
CTX50-1 | Eaton | INDUCT ARRAY 2 COIL 50.63UH SMD | Forespørgsel |
|
VP3-0780-R | Eaton | INDUCT ARRAY 6 COIL 63.2UH SMD | Forespørgsel |
|
VP3-0138-R | Eaton | INDUCT ARRAY 6 COIL 11.2UH SMD | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers