Købe VS-GA300TD60S med BYCHPS
Køb med garanti
VS-GA300TD60S
- Varenummer:
- VS-GA300TD60S
- Fabrikant:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- IGBT 600V 530A 1136W INT-A-PAK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18080 Pieces
- Datablad:
- VS-GA300TD60S.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for VS-GA300TD60S, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til VS-GA300TD60S via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 600V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 1.45V @ 15V, 300A |
| Leverandør Device Package: | Dual INT-A-PAK |
| Serie: | - |
| Strøm - Max: | 1136W |
| Pakke / tilfælde: | Dual INT-A-PAK (3 + 8) |
| Andre navne: | VSGA300TD60S |
| Driftstemperatur: | -40°C ~ 150°C (TJ) |
| NTC termistor: | No |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 19 Weeks |
| Producentens varenummer: | VS-GA300TD60S |
| Inputkapacitans (Cies) @ Vce: | - |
| Input: | Standard |
| IGBT Type: | - |
| Udvidet beskrivelse: | IGBT Module Half Bridge 600V 530A 1136W Chassis Mount Dual INT-A-PAK |
| Beskrivelse: | IGBT 600V 530A 1136W INT-A-PAK |
| Nuværende - Collector Cutoff (Max): | 750µA |
| Nuværende - Samler (Ic) (Max): | 530A |
| Konfiguration: | Half Bridge |
| Email: | [email protected] |
Relaterede dele til VS-GA300TD60S
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers