Købe VS-GB400TH120U med BYCHPS
Køb med garanti
VS-GB400TH120U
- Varenummer:
- VS-GB400TH120U
- Fabrikant:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- IGBT 1200V 660A 2660W INT-A-PAK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14694 Pieces
- Datablad:
- VS-GB400TH120U.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for VS-GB400TH120U, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til VS-GB400TH120U via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 1200V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 3.6V @ 15V, 400A |
| Leverandør Device Package: | Double INT-A-PAK |
| Serie: | - |
| Strøm - Max: | 2660W |
| Pakke / tilfælde: | Double INT-A-PAK (3 + 4) |
| Andre navne: | VSGB400TH120U |
| Driftstemperatur: | 150°C (TJ) |
| NTC termistor: | No |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 19 Weeks |
| Producentens varenummer: | VS-GB400TH120U |
| Inputkapacitans (Cies) @ Vce: | 33.7nF @ 30V |
| Input: | Standard |
| IGBT Type: | NPT |
| Udvidet beskrivelse: | IGBT Module NPT Half Bridge 1200V 660A 2660W Chassis Mount Double INT-A-PAK |
| Beskrivelse: | IGBT 1200V 660A 2660W INT-A-PAK |
| Nuværende - Collector Cutoff (Max): | 5mA |
| Nuværende - Samler (Ic) (Max): | 660A |
| Konfiguration: | Half Bridge |
| Email: | [email protected] |
Relaterede dele til VS-GB400TH120U
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog