Købe VS-HFA12PA120CPBF med BYCHPS
Køb med garanti
VS-HFA12PA120CPBF
- Varenummer:
- VS-HFA12PA120CPBF
- Fabrikant:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- DIODE ARRAY GP 1200V 6A TO247AC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16609 Pieces
- Datablad:
- VS-HFA12PA120CPBF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for VS-HFA12PA120CPBF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til VS-HFA12PA120CPBF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 3V @ 6A |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 1200V (1.2kV) |
| Leverandør Device Package: | TO-247AC |
| Fart: | Fast Recovery = 200mA (Io) |
| Serie: | HEXFRED® |
| Reverse Recovery Time (trr): | 80ns |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-247-3 |
| Andre navne: | *HFA12PA120CPBF HFA12PA120CPBF HFA12PA120CPBF-ND |
| Driftstemperatur - Junction: | -55°C ~ 150°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | VS-HFA12PA120CPBF |
| Udvidet beskrivelse: | Diode Array 1 Pair Common Cathode Standard 1200V (1.2kV) 6A (DC) Through Hole TO-247-3 |
| Diodetype: | Standard |
| Diode Konfiguration: | 1 Pair Common Cathode |
| Beskrivelse: | DIODE ARRAY GP 1200V 6A TO247AC |
| Nuværende - Reverse Lækage @ Vr: | 5µA @ 1200V |
| Nuværende - Gennemsnitlig Rectified (Io) (pr. Diode): | 6A (DC) |
| Email: | [email protected] |
Relaterede dele til VS-HFA12PA120CPBF
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers