Købe WI140316WQ75236BJ2 med BYCHPS
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WI140316WQ75236BJ2
- Varenummer:
- WI140316WQ75236BJ2
- Fabrikant:
- Draloric / Vishay
- Beskrivelse:
- CAP CER 7500PF 22.5KV SCREW
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 12231 Pieces
- Datablad:
- WI140316WQ75236BJ2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for WI140316WQ75236BJ2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til WI140316WQ75236BJ2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 22500V (22.5kV) |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | - |
| Temperaturkoefficient: | - |
| Størrelse / Dimension: | 5.472" Dia (139.00mm) |
| Serie: | - |
| Vurderinger: | - |
| Emballage: | Bulk |
| Pakke / tilfælde: | Nonstandard, Screw Terminals |
| Driftstemperatur: | - |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 20 Weeks |
| Producentens varenummer: | WI140316WQ75236BJ2 |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | 12.736" (323.50mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 7500pF ±10% 22500V (22.5kV) Ceramic Capacitor Nonstandard, Screw Terminals |
| Beskrivelse: | CAP CER 7500PF 22.5KV SCREW |
| kapacitans: | 7500pF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til WI140316WQ75236BJ2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
WI140316WQ75236BJ3 | Vishay Beyschlag | CAP CER 7500PF 22.5KV SCREW | Forespørgsel |
|
WI140316WQ75236BJ4 | Vishay Beyschlag | CAP CER 7500PF 22.5KV SCREW | Forespørgsel |
|
WI140316WQ75236BJ1 | Vishay Beyschlag | CAP CER 7500PF 22.5KV SCREW | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers