Købe WR303050-15F5-G med BYCHPS
Køb med garanti
WR303050-15F5-G
- Varenummer:
- WR303050-15F5-G
- Fabrikant:
- TDK Corporation
- Beskrivelse:
- RX 1 COIL 1 LAYER 12.3UH
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19357 Pieces
- Datablad:
- WR303050-15F5-G.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for WR303050-15F5-G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til WR303050-15F5-G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | 1 Coil, 1 Layer |
|---|---|
| Tolerance: | - |
| Størrelse / Dimension: | 1.18" L x 1.16" W x 0.03" H (30.0mm x 29.6mm x 1.0mm) |
| Serie: | WR |
| Q @ Freq: | - |
| Andre navne: | 445-16092 |
| Driftstemperatur: | - |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | WR303050-15F5-G |
| selvinduktion: | 12.3µH |
| Fungere: | Receiver |
| Frekvens - Selvresonans: | - |
| Udvidet beskrivelse: | 1 Coil, 1 Layer 12.3µH Wireless Charging Coil Receiver 410 mOhm |
| Beskrivelse: | RX 1 COIL 1 LAYER 12.3UH |
| DC-resistens (DCR): | 410 mOhm |
| Nuværende vurdering: | - |
| Nuværende - Mætning: | - |
| Email: | [email protected] |
Relaterede dele til WR303050-15F5-G
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
WR303050-12F5-ID | TDK Corporation | RX 1 COIL 1 LAYER 8.23UH | Forespørgsel |
 |
760308102212 | Wurth Electronics Inc. | RX 1 COIL 1 LAYER 5.4UH 2A | Forespørgsel |
 |
AWCCA-107T52H40-C01-B | Abracon LLC | TX 3 COIL 1 LAYER 11.5UH 12UH | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers