Købe WSL1206R0150FEA med BYCHPS
Køb med garanti
WSL1206R0150FEA
- Varenummer:
- WSL1206R0150FEA
- Fabrikant:
- Dale / Vishay
- Beskrivelse:
- RES SMD 0.015 OHM 1% 1/4W 1206
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18368 Pieces
- Datablad:
- WSL1206R0150FEA.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for WSL1206R0150FEA, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til WSL1206R0150FEA via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±1% |
|---|---|
| Temperaturkoefficient: | ±75ppm/°C |
| Leverandør Device Package: | 1206 |
| Størrelse / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Serie: | WSL |
| Modstand (ohm): | 0.015 |
| Power (Watts): | 0.25W, 1/4W |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1206 (3216 Metric) |
| Andre navne: | WSLC-.015TR |
| Driftstemperatur: | -65°C ~ 170°C |
| Antal Afslutninger: | 2 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 40 Weeks |
| Producentens varenummer: | WSL1206R0150FEA |
| Højde - Siddende (Max): | 0.035" (0.89mm) |
| Funktioner: | Automotive AEC-Q200, Current Sense, Moisture Resistant, Pulse Withstanding |
| Fejlrate: | - |
| Udvidet beskrivelse: | 0.015 Ohm ±1% 0.25W, 1/4W Chip Resistor 1206 (3216 Metric) Automotive AEC-Q200, Current Sense, Moisture Resistant, Pulse Withstanding Metal Element |
| Beskrivelse: | RES SMD 0.015 OHM 1% 1/4W 1206 |
| Sammensætning: | Metal Element |
| Email: | [email protected] |
Relaterede dele til WSL1206R0150FEA
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers