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XCKU5P-2FFVA676E
- Varenummer:
- XCKU5P-2FFVA676E
- Fabrikant:
- Xilinx
- Beskrivelse:
- XCKU5P-2FFVA676E
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14132 Pieces
- Datablad:
- XCKU5P-2FFVA676E.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for XCKU5P-2FFVA676E, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til XCKU5P-2FFVA676E via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 0.87 V ~ 0.93 V |
|---|---|
| Samlet RAM-bit: | 35737600 |
| Leverandør Device Package: | 676-FCBGA (27x27) |
| Serie: | Kintex® UltraScale+™ |
| Pakke / tilfælde: | 676-BBGA, FCBGA |
| Driftstemperatur: | 0°C ~ 100°C (TJ) |
| Antal logiske elementer / celler: | 474600 |
| Antal LAB'er / CLB'er: | 27120 |
| Antal I / O: | 256 |
| Monteringstype: | Surface Mount |
| Producentens varenummer: | XCKU5P-2FFVA676E |
| Beskrivelse: | XCKU5P-2FFVA676E |
| Email: | [email protected] |
Relaterede dele til XCKU5P-2FFVA676E
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
XCKU5P-2FFVA676I | Xilinx Inc. | IC FPGA 256 I/O 676FCBGA | Forespørgsel |
|
XCKU5P-1FFVA676I | Xilinx Inc. | IC FPGA 256 I/O 676FCBGA | Forespørgsel |
|
XCKU5P-1FFVB676E | Xilinx Inc. | IC FPGA 280 I/O 676FCBGA | Forespørgsel |
|
XCKU5P-3FFVB676E | Xilinx Inc. | IC FPGA 280 I/O 676FCBGA | Forespørgsel |
|
XCKU5P-3FFVA676E | Xilinx Inc. | IC FPGA 256 I/O 676FCBGA | Forespørgsel |
|
XCKU5P-2FFVB676I | Xilinx Inc. | IC FPGA 280 I/O 676FCBGA | Forespørgsel |
|
XCKU5P-L1FFVB676I | Xilinx Inc. | IC FPGA 280 I/O 676FCBGA | Forespørgsel |
|
XCKU5P-1FFVB676I | Xilinx Inc. | IC FPGA 280 I/O 676FCBGA | Forespørgsel |
|
XCKU5P-L1FFVA676I | Xilinx Inc. | IC FPGA 256 I/O 676FCBGA | Forespørgsel |
|
XCKU5P-1FFVA676E | Xilinx Inc. | IC FPGA 256 I/O 676FCBGA | Forespørgsel |
|
XCKU5P-2FFVB676E | Xilinx Inc. | IC FPGA 280 I/O 676FCBGA | Forespørgsel |
Laast News
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- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers