Købe XL60-2R7308W-R med BYCHPS
Køb med garanti
XL60-2R7308W-R
- Varenummer:
- XL60-2R7308W-R
- Fabrikant:
- Bussmann (Eaton)
- Beskrivelse:
- CAP SUPER 3000F 2.7V WELD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13618 Pieces
- Datablad:
- XL60-2R7308W-R.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for XL60-2R7308W-R, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til XL60-2R7308W-R via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.7V |
|---|---|
| Tolerance: | 0%, +20% |
| Afslutning: | Weld Stud |
| Størrelse / Dimension: | 2.390" Dia x 5.433" L (60.70mm x 138.00mm) |
| Serie: | PowerStor XL60 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Axial, Can |
| Andre navne: | 283-4486 |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | XL60-2R7308W-R |
| Levetid @ Temp.: | 1500 Hrs @ 65°C |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Udvidet beskrivelse: | 3000F 0%, +20%(EDLC) Supercapacitor 2.7V Axial, Can 0.23 mOhm 1500 Hrs @ 65°C |
| ESR (Equivalent Series Resistance): | 0.23 mOhm |
| Beskrivelse: | CAP SUPER 3000F 2.7V WELD |
| kapacitans: | 3000F |
| Email: | [email protected] |
Relaterede dele til XL60-2R7308W-R
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
2.5DMB4R7M10X20 | Rubycon | CAP 4.7F 20% 2.5V THROUGH HOLE | Forespørgsel |
 |
HV0820-2R7305-R | Eaton | CAP 3F -10% +30% 2.7V T/H | Forespørgsel |
 |
DH-5R5D224T | Elna America | CAP 220MF -20% +80% 5.5V T/H | Forespørgsel |
 |
HB1840-2R5606-R | Eaton | CAP 60F -10% +30% 2.5V T/H | Forespørgsel |
 |
XL60-2R7308T-R | Eaton | CAP SUPER 3000F 2.7VDC SCREW | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog