Købe ZCAT6819-5230D med BYCHPS
Køb med garanti
ZCAT6819-5230D
- Varenummer:
- ZCAT6819-5230D
- Fabrikant:
- TDK Corporation
- Beskrivelse:
- FERRITE CORE 35 OHM HINGED
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16216 Pieces
- Datablad:
- ZCAT6819-5230D.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ZCAT6819-5230D, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ZCAT6819-5230D via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Flat |
|---|---|
| Serie: | ZCAT |
| Vurderinger: | - |
| Ydermål: | 2.657" W x 0.629" H (67.50mm x 16.00mm) |
| Andre navne: | 445-6696 ZCAT68195230D |
| Monteringstype: | Free Hanging |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale: | 30 |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | ZCAT6819-5230D |
| Længde: | 0.728" (18.50mm) |
| Indvendig Dimension: | 2.047" W x 0.051" H (52.00mm x 1.30mm) |
| Impedans @ Frekvens: | 35 Ohm @ 50MHz ~ 500MHz |
| Udvidet beskrivelse: | Hinged (Snap On) Free Hanging Ferrite Core 35 Ohm @ 50MHz ~ 500MHz ID 2.047" W x 0.051" H (52.00mm x 1.30mm) OD 2.657" W x 0.629" H (67.50mm x 16.00mm) Length 0.728" (18.50mm) |
| Design: | Hinged (Snap On) |
| Beskrivelse: | FERRITE CORE 35 OHM HINGED |
| Email: | [email protected] |
Relaterede dele til ZCAT6819-5230D
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
ESD-R-12D | KEMET | FERRITE CORE SOLID 6MM | Forespørgsel |
 |
ZCAT6819-5230DT-BK | TDK Corporation | FERRITE CORE 35 OHM HINGED | Forespørgsel |
 |
7427013 | Wurth Electronics Inc. | FERRITE CORE 159 OHM SOLID 16MM | Forespørgsel |
 |
ESD-SR-150 | KEMET | FERRITE CORE HINGED 7MM | Forespørgsel |
 |
ZCAT6819-5230D-BK | TDK Corporation | FERRITE CORE 35 OHM HINGED | Forespørgsel |
|
ZCAT6819-5230DT | TDK Corporation | FERRITE CORE 35 OHM HINGED | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog