Købe 27E396 med BYCHPS
Køb med garanti
27E396
- Varenummer:
- 27E396
- Beskrivelse:
- SOCKET RELAY 1-3 POLES QC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15636 Pieces
- Datablad:
- 27E396.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 27E396, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 27E396 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Socket |
|---|---|
| Afslutningsstil: | Quick Connect - 0.187" (4.7mm) |
| Serie: | KU |
| Andre navne: | 3-1393143-8 PB810 |
| Antal positioner: | 11 |
| Monteringstype: | Panel Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 27E396 |
| Til brug med / relaterede produkter: | KU Series |
| Funktioner: | - |
| Udvidet beskrivelse: | Relay Socket Panel Mount |
| Beskrivelse: | SOCKET RELAY 1-3 POLES QC |
| Email: | [email protected] |
Relaterede dele til 27E396
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
27E1064 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY PCB 10A | Forespørgsel |
 |
SKT10000 | Red Lion Controls | 8-PIN SOCKET | Forespørgsel |
 |
1904045-3 | TE Connectivity Potter & Brumfield Relays | V23333Z0002A010-EV-000 | Forespørgsel |
 |
P6BF4BNDDC12 | Omron Electronics Inc-EMC Div | RELAY SOCKET DIN G3S4 G6B-4 | Forespørgsel |
 |
P2RF-08-S | Omron Automation and Safety | SOCKET RELAY SCREWLESS G2R-2-S | Forespørgsel |
 |
RSE120158-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørgsel |
|
27E164 | TE Connectivity Potter & Brumfield Relays | SOCKET PHEN 6POLE FOR R10 SER | Forespørgsel |
 |
2967015 | Phoenix Contact | 14MM PLC BASIC TERM BLOCK 24V | Forespørgsel |
 |
2-1904045-7 | TE Connectivity Potter & Brumfield Relays | V23333Z0002B049-EV-100 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers