Købe 28B0735-300 med BYCHPS
Køb med garanti
28B0735-300
- Varenummer:
- 28B0735-300
- Beskrivelse:
- FERRITE CORE 150 OHM SOLID
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14862 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 28B0735-300, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 28B0735-300 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | 28 |
| Vurderinger: | - |
| Ydermål: | 0.735" Dia (18.67mm) |
| Andre navne: | 240-2311 28B0735300 |
| Monteringstype: | Free Hanging |
| Materiale: | 28 |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | 28B0735-300 |
| Længde: | 0.562" (14.27mm) |
| Indvendig Dimension: | 0.400" Dia (10.16mm) |
| Impedans @ Frekvens: | 150 Ohm @ 100MHz |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core 150 Ohm @ 100MHz ID 0.400" Dia (10.16mm) OD 0.735" Dia (18.67mm) Length 0.562" (14.27mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 150 OHM SOLID |
| Email: | [email protected] |
Relaterede dele til 28B0735-300
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
74270010 | Wurth Electronics Inc. | FERRITE CORE 55 OHM SOLID 1.2MM | Forespørgsel |
 |
28B0735-000 | Laird-Signal Integrity Products | FERRITE CORE 250 OHM SOLID | Forespørgsel |
 |
28B0734-000 | Laird-Signal Integrity Products | FERRITE CORE 229 OHM SOLID | Forespørgsel |
 |
FSRC222120RX000T | Murata Electronics North America | FERRITE CORE 53 OHM SOLID | Forespørgsel |
 |
28B0773-050 | Laird-Signal Integrity Products | FERRITE CORE 141 OHM SOLID | Forespørgsel |
 |
28A0392-0A2 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM HINGED | Forespørgsel |
 |
ESD-R-19 | KEMET | FERRITE CORE SOLID 9MM | Forespørgsel |
 |
HFB143064-200 | Laird-Signal Integrity Products | FERRITE CORE HINGED | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers