Købe 28B0773-050 med BYCHPS
Køb med garanti
28B0773-050
- Varenummer:
- 28B0773-050
- Beskrivelse:
- FERRITE CORE 141 OHM SOLID
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19428 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 28B0773-050, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 28B0773-050 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | 28 |
| Vurderinger: | - |
| Ydermål: | 0.773" W x 0.515" H (19.64mm x 13.10mm) |
| Andre navne: | 240-2497 28B0773050 |
| Monteringstype: | Free Hanging |
| Materiale: | 28 |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | 28B0773-050 |
| Længde: | 0.500" (12.70mm) |
| Indvendig Dimension: | 0.458" W x 0.201" H (11.64mm x 5.10mm) |
| Impedans @ Frekvens: | 141 Ohm @ 100MHz |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core 141 Ohm @ 100MHz ID 0.458" W x 0.201" H (11.64mm x 5.10mm) OD 0.773" W x 0.515" H (19.64mm x 13.10mm) Length 0.500" (12.70mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 141 OHM SOLID |
| Email: | [email protected] |
Relaterede dele til 28B0773-050
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
28B0735-000 | Laird-Signal Integrity Products | FERRITE CORE 250 OHM SOLID | Forespørgsel |
 |
FB73-085 | Bourns Inc. | FERRITE CORE SOLID 0.78MM | Forespørgsel |
 |
28B0734-000 | Laird-Signal Integrity Products | FERRITE CORE 229 OHM SOLID | Forespørgsel |
 |
74270093 | Wurth Electronics Inc. | FERRITE CORE 150 OHM SOLID | Forespørgsel |
 |
28B0625-000 | Laird-Signal Integrity Products | FERRITE CORE 163 OHM SOLID | Forespørgsel |
 |
28B0562-0R0 | Laird-Signal Integrity Products | FERRITE CORE SOLID | Forespørgsel |
 |
28B0735-300 | Laird-Signal Integrity Products | FERRITE CORE 150 OHM SOLID | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers