Købe 28R1779-000 med BYCHPS
Køb med garanti
28R1779-000
- Varenummer:
- 28R1779-000
- Beskrivelse:
- FERRITE CORE 298 OHM SOLID
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14640 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 28R1779-000, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 28R1779-000 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Flat |
|---|---|
| Serie: | 28 |
| Vurderinger: | - |
| Ydermål: | 2.500" W x 0.500" H (63.50mm x 12.70mm) |
| Andre navne: | 10684 240-2088 28R1779000 RS1779X |
| Monteringstype: | Free Hanging |
| Materiale: | 28 |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | 28R1779-000 |
| Længde: | 1.125" (28.58mm) |
| Indvendig Dimension: | 2.050" W x 0.066" H (52.07mm x 1.68mm) |
| Impedans @ Frekvens: | 298 Ohm @ 100MHz |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core 298 Ohm @ 100MHz ID 2.050" W x 0.066" H (52.07mm x 1.68mm) OD 2.500" W x 0.500" H (63.50mm x 12.70mm) Length 1.125" (28.58mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 298 OHM SOLID |
| Email: | [email protected] |
Relaterede dele til 28R1779-000
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
ESD-R-25D-B | KEMET | FERRITE CORE CLAMP 13.9MM | Forespørgsel |
 |
742700713 | Wurth Electronics Inc. | FERRITE CORE 58 OHM SOLID 1.3MM | Forespørgsel |
 |
28R1775-000 | Laird-Signal Integrity Products | FERRITE CORE 260 OHM SOLID | Forespørgsel |
 |
28R1779-100 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM SOLID | Forespørgsel |
 |
FSRC141060RXB00T | Murata Electronics North America | FERRITE CORE 39 OHM SOLID | Forespørgsel |
 |
28R0614-400 | Laird-Signal Integrity Products | FERRITE CORE SOLID | Forespørgsel |
|
28R1799-010 | Laird-Signal Integrity Products | FERRITE CORE 172 OHM SOLID | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers