Købe 28R1799-010 med BYCHPS
Køb med garanti
28R1799-010
- Varenummer:
- 28R1799-010
- Beskrivelse:
- FERRITE CORE 172 OHM SOLID
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14013 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 28R1799-010, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 28R1799-010 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Flat |
|---|---|
| Serie: | 28 |
| Vurderinger: | - |
| Ydermål: | 1.795" W x 0.311" H (45.60mm x 7.90mm) |
| Monteringstype: | Free Hanging |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale: | 28 |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | 28R1799-010 |
| Længde: | 0.724" (18.40mm) |
| Indvendig Dimension: | 1.457" W x 0.055" H (37.00mm x 1.40mm) |
| Impedans @ Frekvens: | 172 Ohm @ 100MHz |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core 172 Ohm @ 100MHz ID 1.457" W x 0.055" H (37.00mm x 1.40mm) OD 1.795" W x 0.311" H (45.60mm x 7.90mm) Length 0.724" (18.40mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 172 OHM SOLID |
| Email: | [email protected] |
Relaterede dele til 28R1799-010
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
KR50TA251512B1 | Panasonic - DTG | FERRITE CORE 14 OHM CLAMP 13.5MM | Forespørgsel |
 |
28R1779-000 | Laird-Signal Integrity Products | FERRITE CORE 298 OHM SOLID | Forespørgsel |
 |
28S2001-1M0 | Laird-Signal Integrity Products | FERRITE CORE 150 OHM CLIP 2PCS=1 | Forespørgsel |
 |
AB5X4X3DY | Toshiba Semiconductor and Storage | FERRITE CORE SOLID | Forespørgsel |
 |
28R1775-000 | Laird-Signal Integrity Products | FERRITE CORE 260 OHM SOLID | Forespørgsel |
 |
74270117 | Wurth Electronics Inc. | FERRITE CORE 161 OHM SOLID 10MM | Forespørgsel |
 |
28R1779-100 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM SOLID | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers