Købe 304DCN2R7SCBB med BYCHPS
Køb med garanti
304DCN2R7SCBB
- Varenummer:
- 304DCN2R7SCBB
- Fabrikant:
- Illinois Capacitor
- Beskrivelse:
- CAP 300MF -20%, +50% 2.7V T/H
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16286 Pieces
- Datablad:
- 304DCN2R7SCBB.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 304DCN2R7SCBB, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 304DCN2R7SCBB via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.7V |
|---|---|
| Tolerance: | -20%, +50% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.157" Dia (4.00mm) |
| Serie: | DCN |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 1572-1250 |
| Driftstemperatur: | -40°C ~ 60°C |
| Monteringstype: | Through Hole |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | 304DCN2R7SCBB |
| Levetid @ Temp.: | 1000 Hrs @ 60°C |
| Blyafstand: | 0.059" (1.50mm) |
| Højde - Siddende (Max): | 0.492" (12.50mm) |
| Udvidet beskrivelse: | 300mF -20%, +50%(EDLC) Supercapacitor 2.7V Radial, Can 1 Ohm 1000 Hrs @ 60°C |
| ESR (Equivalent Series Resistance): | 1 Ohm |
| Beskrivelse: | CAP 300MF -20%, +50% 2.7V T/H |
| kapacitans: | 300mF |
| Email: | [email protected] |
Relaterede dele til 304DCN2R7SCBB
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EEC-S5R5V474N | Panasonic Electronic Components | CAP .47F 5.5V T/H | Forespørgsel |
 |
DCK-3R3E204T614-E | Elna America | CAP 200MF -20% +80% 3.3V SMD | Forespørgsel |
 |
EDLNF474B5R5C | Cornell Dubilier Electronics (CDE) | CAP 470MF 5.5V THROUGH HOLE | Forespørgsel |
 |
HB1030-2R5106-R | Eaton | CAP 10F -10% +30% 2.5V T/H | Forespørgsel |
 |
MAL219691105E3 | Vishay BC Components | CAP ALUM 4F 7.0V SNAP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog