Købe ADN3000-06-50A-PT7 med BYCHPS
Køb med garanti
ADN3000-06-50A-PT7
- Varenummer:
- ADN3000-06-50A-PT7
- Fabrikant:
- AD
- Beskrivelse:
- IC AMP TRANSIMPEDANCE DIEFORM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19517 Pieces
- Datablad:
- ADN3000-06-50A-PT7.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ADN3000-06-50A-PT7, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ADN3000-06-50A-PT7 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Transimpedance Amplifier |
|---|---|
| Leverandør Device Package: | Die |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Die |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | ADN3000-06-50A-PT7 |
| Udvidet beskrivelse: | Transimpedance Amplifier IC Optical Networks Die |
| Beskrivelse: | IC AMP TRANSIMPEDANCE DIEFORM |
| Applikationer: | Optical Networks |
| Email: | [email protected] |
Relaterede dele til ADN3000-06-50A-PT7
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
|
ADN3010-11-50A-DF | Analog Devices Inc. | IC OPT RCVR 11.3GBP 6"FILM FRAME | Forespørgsel |
|
ADN3010-11-50A-RL7 | Analog Devices Inc. | IC AMP TRANSIMPEDANCE DIEFORM | Forespørgsel |
|
ADN3000-06-50A-PT | Analog Devices Inc. | IC AMP TRANSIMPEDANCE DIEFORM | Forespørgsel |
 |
MAX3964AETP+T | Maxim Integrated | IC AMP LIMITING SGNL DET 20-TQFN | Forespørgsel |
 |
SY88903VKG-TR | Microchip Technology | IC AMP POST PECL 3.3V TTL 10MSOP | Forespørgsel |
 |
MAX4373HEUA+ | Maxim Integrated | IC AMP CURRENT SENSE 8-UMAX | Forespørgsel |
 |
AD8334ACPZ | Analog Devices Inc. | IC VGA QUAD W/PREAMP 64LFCSP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers