Købe ADN3010-11-50A-DF med BYCHPS
Køb med garanti
ADN3010-11-50A-DF
- Varenummer:
- ADN3010-11-50A-DF
- Fabrikant:
- AD
- Beskrivelse:
- IC OPT RCVR 11.3GBP 6"FILM FRAME
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15540 Pieces
- Datablad:
- ADN3010-11-50A-DF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ADN3010-11-50A-DF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ADN3010-11-50A-DF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Receiver |
|---|---|
| Leverandør Device Package: | Die |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | Die |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | ADN3010-11-50A-DF |
| Udvidet beskrivelse: | Receiver IC Optical Die |
| Beskrivelse: | IC OPT RCVR 11.3GBP 6"FILM FRAME |
| Applikationer: | Optical |
| Email: | [email protected] |
Relaterede dele til ADN3010-11-50A-DF
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
GN25L53-GRP6 | Semtech Corporation | IC AMP TIA 2.5GB OC-48 DIE RING | Forespørgsel |
|
ADN3010-11-50A-RL7 | Analog Devices Inc. | IC AMP TRANSIMPEDANCE DIEFORM | Forespørgsel |
|
THS770012IRGET | Texas Instruments | IC AMP DIFF ADC DVR 16BIT 24VQFN | Forespørgsel |
 |
MAX4373TESA+T | Maxim Integrated | IC AMP CURRENT SENSE 8-SOIC | Forespørgsel |
|
ADN3000-06-50A-PT7 | Analog Devices Inc. | IC AMP TRANSIMPEDANCE DIEFORM | Forespørgsel |
 |
MAX3272AETP+ | Maxim Integrated | IC AMP LIMITING 20-TQFN | Forespørgsel |
 |
LTC6405CMS8E#PBF | Linear Technology | IC AMP/DRVR DIFF R-R 5V 8-MSOP | Forespørgsel |
 |
SY88983VMI | Microchip Technology | IC AMP POST 5/3.3V TTL SD 16-MLF | Forespørgsel |
|
ADN3000-06-50A-PT | Analog Devices Inc. | IC AMP TRANSIMPEDANCE DIEFORM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog