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B25838K8105K1
- Varenummer:
- B25838K8105K1
- Fabrikant:
- EPCOS
- Beskrivelse:
- CAP FILM 1UF 10% 1.1KVAC QC TERM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16886 Pieces
- Datablad:
- B25838K8105K1.pdf
Introduktion
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specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | 1100V (1.1kV) |
| Tolerance: | ±10% |
| Afslutning: | Quick Connect Tab - 0.248" (6.30mm) |
| Størrelse / Dimension: | 1.575" Dia (40.00mm) |
| Serie: | B25838 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | B25838K8105K 1 B25838K8105K001 |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B25838K8105K1 |
| Blyafstand: | 1.378" (35.00mm) |
| Højde - Siddende (Max): | 3.740" (95.00mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 1µF ±10% Film Capacitor 1100V (1.1kV) Radial, Can |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | - |
| Beskrivelse: | CAP FILM 1UF 10% 1.1KVAC QC TERM |
| kapacitans: | 1µF |
| Applikationer: | Damping |
| Email: | [email protected] |
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B25838L8186K4 | EPCOS (TDK) | CAP FILM 18UF 10% 1.1KVAC SCREW | Forespørgsel |
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B25838K8126K4 | EPCOS (TDK) | CAP FILM 12UF 1.1KVAC QC TERM | Forespørgsel |
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B25838K8186K4 | EPCOS (TDK) | CAP FILM 18UF 1.1KVAC QC TERM | Forespørgsel |
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B25838L6156K4 | EPCOS (TDK) | CAP FILM 15UF 10% 900VAC SCREW | Forespørgsel |
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B25838T8225J4 | EPCOS (TDK) | CAP FILM 2.2UF 1.1KVAC QC TERM | Forespørgsel |
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B25838K6225K1 | EPCOS (TDK) | CAP FILM 2.2UF 900VAC QC TERM | Forespørgsel |
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B25838L4226K4 | EPCOS (TDK) | CAP FILM 22UF 10% 600VAC SCREW | Forespørgsel |
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B25838L8226K4 | EPCOS (TDK) | CAP FILM 22UF 10% 1.1KVAC SCREW | Forespørgsel |
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B25838T5605K14 | EPCOS (TDK) | CAP FILM 6UF 10% 750VAC QC TERM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
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- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers