Købe BCAP0350 E270 T13 med BYCHPS
Køb med garanti
BCAP0350 E270 T13
- Varenummer:
- BCAP0350 E270 T13
- Fabrikant:
- Maxwell Technologies, Inc.
- Beskrivelse:
- CAP 350F 2.7V THROUGH HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19725 Pieces
- Datablad:
- BCAP0350 E270 T13.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BCAP0350 E270 T13, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BCAP0350 E270 T13 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.7V |
|---|---|
| Tolerance: | - |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | - |
| Serie: | BC |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 108860 |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 4 Weeks |
| Producentens varenummer: | BCAP0350 E270 T13 |
| Levetid @ Temp.: | 1500 Hrs @ 65°C |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Udvidet beskrivelse: | 350F (EDLC) Supercapacitor 2.7V Radial, Can 3.2 mOhm 1500 Hrs @ 65°C |
| ESR (Equivalent Series Resistance): | 3.2 mOhm |
| Beskrivelse: | CAP 350F 2.7V THROUGH HOLE |
| kapacitans: | 350F |
| Email: | [email protected] |
Relaterede dele til BCAP0350 E270 T13
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog