Købe CM1200HA-24J med BYCHPS
Køb med garanti
CM1200HA-24J
- Varenummer:
- CM1200HA-24J
- Fabrikant:
- Powerex, Inc.
- Beskrivelse:
- IGBT MOD SGL 1200V 1200A H SER
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 16519 Pieces
- Datablad:
- CM1200HA-24J.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CM1200HA-24J, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CM1200HA-24J via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 1200V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 3.1V @ 15V, 1200A |
| Leverandør Device Package: | Module |
| Serie: | IGBTMOD™ |
| Strøm - Max: | 5800W |
| Pakke / tilfælde: | Module |
| Driftstemperatur: | -40°C ~ 150°C (TJ) |
| NTC termistor: | No |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | CM1200HA-24J |
| Inputkapacitans (Cies) @ Vce: | 200nF @ 10V |
| Input: | Standard |
| IGBT Type: | - |
| Udvidet beskrivelse: | IGBT Module Single 1200V 1200A 5800W Chassis Mount Module |
| Beskrivelse: | IGBT MOD SGL 1200V 1200A H SER |
| Nuværende - Collector Cutoff (Max): | 6mA |
| Nuværende - Samler (Ic) (Max): | 1200A |
| Konfiguration: | Single |
| Email: | [email protected] |
Relaterede dele til CM1200HA-24J
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MIXA40W1200TMH | IXYS | IGBT MODULE 1200V 40A | Forespørgsel |
 |
APTCV60TLM99T3G | Microsemi Corporation | POWER MODULE IGBT QUAD 600V SP3 | Forespørgsel |
 |
APTGT150A120D1G | Microsemi Corporation | IGBT MODULE TRENCH PHASE LEG D1 | Forespørgsel |
 |
APT200GN60JDQ4G | Microsemi Corporation | IGBT 600V 283A 682W SOT227 | Forespørgsel |
|
IXGN100N170 | IXYS | IGBT 1700V 160A GENX3 SOT-227B | Forespørgsel |
|
APT150GT120JR | Microsemi Corporation | IGBT 1200V 170A 830W SOT227 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers