Købe NESG7030M04-A med BYCHPS
Køb med garanti
NESG7030M04-A
- Varenummer:
- NESG7030M04-A
- Fabrikant:
- CEL (California Eastern Laboratories)
- Beskrivelse:
- DISCRETE RF DIODE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13575 Pieces
- Datablad:
- NESG7030M04-A.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for NESG7030M04-A, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til NESG7030M04-A via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 4.3V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Device Package: | M04 |
| Serie: | - |
| Strøm - Max: | 125mW |
| Emballage: | Bulk |
| Pakke / tilfælde: | SOT-343F |
| Andre navne: | NESG7030M04A |
| Driftstemperatur: | 150°C (TJ) |
| Støjbillede (dB Typ @ f): | 0.5dB ~ 0.75dB @ 2GHz ~ 5.8GHz |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | NESG7030M04-A |
| Gevinst: | 14dB ~ 21dB |
| Frekvens - Overgang: | 5.8GHz |
| Udvidet beskrivelse: | RF Transistor NPN 4.3V 30mA 5.8GHz 125mW Surface Mount M04 |
| Beskrivelse: | DISCRETE RF DIODE |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 200 @ 5mA, 2V |
| Nuværende - Samler (Ic) (Max): | 30mA |
| Email: | [email protected] |
Relaterede dele til NESG7030M04-A
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BFS17NQTA | Diodes Incorporated | TRANSISTOR RF NPN SOT23-3 | Forespørgsel |
 |
2SC4094-T1-A | CEL | RF TRANSISTOR NPN SOT-143 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers